SPI

MS11

MS-11 Series is a inline 3D SPI machine which
inspects the solder amount status after the
solder is spread to clearly grasp the process.
With a 25 Megapixel camera contributing to
productivity enhancements, 0201 (mm) size solder
paste inspection is possible.

  • Dimensions (LxWxH): 1080 x 1470 x 1610 mm
  • Inspection Capability:
    • 6 µm: 0201 (mm) Solder Paste | ±2 mm Warpage
    • 10 µm: 0402 (mm) Solder Paste | ±3 mm Warpage
    • 15 µm: 0603 (mm) Solder Paste | ±5 mm Warpage
    • 20 µm: 0805 (mm) Solder Paste | ±6 mm Warpage
  • 3D Inspection Technology: Shadow Free – Moiré 3D Phase Step Image Processing
  • Solder Height: Max. 600 µm (Option : 650 µm) Min. 40 µm
  • Height Resolution: 0.1 µm
  • Height Accuracy: ±1 %
  • Inspection Speed: 
    • 25 Megapixel Camera: 1,800 mm² / Se
    • 15 Megapixel Camera: 3,000 – 6,600 mm² / Sec
    • 4 Megapixel Camera: 1,500 – 6,000 mm² / Sec
  • PCB Top Side Clearance: 20 mm
  • PCB Bottom Side Clearance: 50 mm
  • PCB Thickness: 0.5 mm ~ 5 mm
  • Maximum PCB Weight: 4 kg
  • Power Requirements: Single Phase(s) 200~240V 50~60Hz, 1.1 kW
AOI

For more detailed information about the equipment and brand download the brochure.