SPI:

Troi 7700E 3D

In-line 3D inspection of solder paste, combining 2D and 3D inspection. Color enhancement algorithms and full 3D rotational view for accurate inspection without removing the PCB from the line.

Model	TROI-7700E
2D/3D Vision Algorithm	2D: Vision Inspection Algorithm 3D: PMP (Phase Measuring Profilometry) Algorithm
Measurements	Volumen, Height, XY Position, Area
Detection Types	Insufficient Past, Excessive Paste, Shape Deformity No Paste, Bridge 2D&3D, Paste Displacement
X/Y Pixel Resolution	10um	15um	18um
Inspection Speed	12.8 cm²/sec	30.7 cm²/sec	42.8 cm²/sec
FOV (Field of View	20.5 x 20.5 mm	30.7 x 30.7 mm	36 x 36 mm
Height Range / Resolution	0 ~ 450 um / 0.4um
Height Repeatability	±1% (3σ)*
Volumen Repeatability	±1% (3σ)*
Height Accuracy	2 um*
Max. PCB Warp	±5 mm
Gage R&R	< 10%
Bell screw	±10 um
PCB Specification	Working Area	Min. 50x50mm (2 x 2 inch) Max. 330x330mm (13x13inch)
	PCB Thickness	0.4 ~ 7.0 mm
	Bottom Clearance	27mm
Installation Requirement	Electrical Requirements	200 – 240 VAC, 50/60 Hz
	Air Requirement	5 Kgf/cm²
	Power Consumption	Standard Type	3kW (14.0 Max @ 220V AC)
		Large Type	4.5kW (30.0 Max @ 220V AC)
Control Unit	Control Method	PC Based Control (Windows 7, 64bit)
	Monitor	24″ LED Panel
Operating	Operating Temperature	20 – 30 °C (68 -86 °F)
Machine Dimension	W x D x H / Weight	990 x 1660 x 1550mm (39 x 65 x 61 inch) / About 700kg (1543 lbs)
Option	Barcode Reader (1D&2D)/Touch Panel/ UPS (uninterrupted power supply)/Close Loop / Bad Mark Sync

Dual Projection
64-bit Windows 7 OS
User Friendly Graphical Interface
Color 3D SPI
Warpage Compensation
FOI (Foreign Object Inspection)
Enchanced SPC System