What is SMT?
Know SMT
SurfaceMount echnology is the system or set of processes used to solder SMC surface mount components, Surface Mount Component on a PCB, Printed Circuit Board. SMCs are micro miniaturized components with or without terminals that are soldered directly in conductive areas located on the surface of the PCB called «lands» footprints without the need to be inserted and go through the THT card, through hole technology.
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The reasons for using SMT technology:
- Miniaturization of electronic products has not been reduced by previously used perforated plug-in components.
- The electronic function of the product is more complete. The integrated circuit (IC) used does not have perforated components, especially large-scale integrated circuits and integration, have to use surface patch components.
- Development of electronic components, development of integrated circuits and diversified applications of semiconductor materials.
- The electronic science and technology revolution is imperative and follows the international trend.
SMT solutions
Learn about the solutions we offer for the electronic manufacturing industry
The productivity and quality of SMT processes is very important to us. That is why we invite you to learn about some of the products that we offer and that will add value to the processes.
IC Programmer
IC programming equipment is of great importance to the electronic manufacturing industry. IC programmers make it possible for everything to work. With Dediprog programmers it is possible to have a perfect balance in productivity and cost. They are excellent equipment since they guarantee a short-term ROI.
Laser Marking
Laser marking equipment is necessary for the electronic manufacturing industry. The equipment uses CO2 and UV technology. Very necessary for marking on PCBs in order to provide a traceability experience that facilitates manufacturing.
Reflow Oven
Reflow ovens for soldering in SMT processes. The FireBox brand offers two ideal models for the process.
Other solutions
We also offer other solutions for electronic manufacturing with SMT process. Packaging machines for SMT & SMD components and spare parts for pick & place equipment, print screen and feeders.
DP3000 G3 | IC programmer a solution SMT excellent
TEA-1000D | Reflow Oven
Basic Features
Power: AC 380 V 3 phase 5wDimensions & Weight: 6000 mm * 1600 mm * 1530 mm | 2950 Kg
PCB size: 50-490 mm (single), 50-270 mm (dual)
Heating time: 30 min
Conveyor speed range: 300-2000 mm/min
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JTR-1200 | Reflow Oven
Basic Features
Power: AC 380 V 3 phase 5wDimensions & Weight: 7050 mm * 1430 mm * 1530 mm | 3000 Kg
PCB size: 400 mm
Heating time: 30 min
Conveyor speed range: 300-2000 mm/min
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DP-1000-G3 | Automated IC Programming System
Basic Features
High Throughput: 3200 UPH.Supported IC: EEPROM, NAND/NOR FLASH, MCU, eMMC, and UFS, etc.
Supported IC Package: SOP, SSOP, TSSOP, PLCC, QFN, LQFP, and BGA, etc.
Support Different Input/Output Peripherals: Input/Output: Tube, Tape, and Tray.
High Expansibility: Able to embed two sets of ProgMaster-S8 (Univesral Devices) or NuProgPlus (Universal & UFS) to expand up to 32 programming sites.
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DP-3000-G3 | Automated IC Programming System
Basic Features
High Throughput: 3200 UPH.Supported IC: EEPROM, NAND/NOR FLASH, MCU, eMMC, and UFS, etc.
Supported IC Package: SOP, SSOP, TSSOP, PLCC, QFN, LQFP, and BGA, etc.
Support Different Input/Output Peripherals: Input/Output: Tube, Tape, and Tray.
High Expansibility: Able to embed two sets of ProgMaster-S8 (Univesral Devices) or NuProgPlus (Universal & UFS) to expand up to 96 programming sites.
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DP2T | Automated IC Programming System
Basic Features
High Throughput: 1000 UPH.Supported IC: EEPROM, NAND/NOR FLASH, MCU, eMMC, and UFS, etc.
Supported IC Package: SOP, SSOP, TSSOP, PLCC, QFN, LQFP, and BGA, etc.
Support Different Input/Output Peripherals: Input/Output: Tube, Tape, and Tray.
High Expansibility: Able to embed two sets of ProgMaster-S8 (Univesral Devices) or NuProgPlus (Universal & UFS) to expand up to 8 programming sites.
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DP-600 | Automated Taping Machine
Basic Features
Mechanical Accuracy +/- 0.04 mm.Support up to 22 inch (550mm) input and 13 inch (330mm) output tape reel.
Supported 32 mm depth carrier tape.
RS232 interface easily communicates with third party automated system.
PSA (Press sensitive adhesive) and heat sealing.
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DP-900 | Automated Repacking System
Basic Features
Mechanical Accuracy: +/- 0.05 mm.Input | Output: Tube, Tray and Tape | Tray or Tape
Sensor for cover tape, empty pocket, floating chip and tray position.
LCD touch screen for main control
Placement nozzle able to perform 360̊ rotation.
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