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SPI:
Troi 7700E 3D
In-line 3D inspection of solder paste, combining 2D and 3D inspection. Color enhancement algorithms and full 3D rotational view for accurate inspection without removing the PCB from the line.
- Dual Projection
- 64-bit Windows 7 OS
- User Friendly Graphical Interface
- Color 3D SPI
- Warpage Compensation
- FOI (Foreign Object Inspection)
- Enchanced SPC System