Selective Soldering:

CUBE.460

The CUBE.460 combines compact design with industrial-grade performance, making it the ideal entry-level selective soldering system for small to medium-sized production. It can be used as a standalone unit or integrated into an automated line. Equipped with precision process control, variable soldering angles, and an efficient micro-drop fluxer, it delivers excellent solder quality with minimal residue and low operating costs.

Key Features:

Compact footprint, easy to integrate or operate standalone.
Adjustable soldering angle (0° or 7°) for challenging layouts.
Efficient quartz preheating with optional top-side heating.
Precise micro-drop fluxing system with optical monitoring.
Exchangeable solder nozzles (Ø4–30 mm) with automatic cleaning.
Optional second soldering module for dual-alloy operation.
Automatic nozzle recognition via integrated camera.
Easy, graphical offline programming and process monitoring.
Low nitrogen and power consumption for high ROI.

Technical Specifications:

PCB size: 20 × 20 mm to 460 × 460 mm (carrier: 550 × 550 mm)
Soldering angle: 0° and 7°
Bottom / top clearance: 30 mm / 150 mm
Preheating: Quartz rods, ~6 kW; top side 3 kW
Fluxer: Micro Drop, 3 L pressure pot with level indicator
Solder pot: 45 kg (lead-free) / 50 kg (SnPb)
Optional: Electrodynamic pump module, 42 kg
Solder nozzles: Ø4 mm – Ø30 mm
Max temperature: 330 °C, PID controlled
Repeatability: ±0.15 mm (±0.006”)
Dimensions: L 1430 × W 1550 × H 1250 mm
Weight: ≈ 800 kg
Power: 6 – 14.4 kW, 3 × 400 V / 50 Hz
Nitrogen: 2 m³/hr per nozzle, max 5.5 bar