+52 899 219 6674 | Contacto@solucinde.com
Reflow Oven:
RS-eCO Series
- Reflow soldering of surface mounted electronic components to PCB
- Excellent heat transfer efficiency and recovery
- Longer heating zone to reduce temperature difference on PCB
- Unique and effective jet nozzle design
- Front & rear heat flow convection
Upgrade maximum conveyor width to 610 mm.
- Standard maximum conveyor width: 460 mm
- For larger PCBs
- Machine external body width will be extended
Dual lane conveyor & dual speed.
- Increase productivity
- Simultaneous reflow for products with different requirements.
Center board support (CBS) system.
- Minimize the chances of PCB drops
- Support large PCBs
- Mesh belt will be removed
Automatic CBS adjustment
- Programmable
Automatic conveyor width adjustment
- Standard conveyor width adjustment method: Motorized
MES customization (i4.0)
- Track & record the parameters of the production
- Customize based on customer’s requirement
Automated profiling system: e-APS/ProBot (OEM by KIC)
- e-APS: 1 hour 1 profile; PROBOT: 1 PCB 1 profile
- Eliminate expensive periodic manual profiling
- Reduce production downtime
- A complete thermal profile management with full traceability