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AOI:
Venus Series
2000
- Advanced 3D automated optical inspection system for accurate and reliable SMT quality control
- 2D + 3D Inspection Technology combining high-resolution imaging, advanced algorithms and AI for comprehensive defect detection.
- Intelligent one-Click programming for fast setup and model changeover with minimal programming experience
- Comprehensive component inspection covering components from 0201 to 0603 Metric and diverse package types
- Multi-angle lighting technology for enhanced inspection of complex PCB and component conditions
- Advanced calibration system for reliable and consistent inspection performance across production lines
- PCB warpage compensation with integrated software and hardware solutions for stable inspection accuracy
- MES integration & SPC data reporting for complete process monitoring, traceability and quality management
- Single lane: Isee 510 / Isee 810
- Dual lane: Isee 510D / Isee 810D
| Model Name | Venus 510 | Venus 810 | Venus 510D | Venus 810D | Venus 2000 |
|---|---|---|---|---|---|
| Dimension (L×W×H mm) | 1100×1450×1600 | 1400×1600×1600 | 1100×1600×1600 | 1400×1600×1600 | 2800×1460×1600 |
| Weight | 1100 kg | 1400 kg | 1250 kg | 1450 kg | 2200 kg |
| Power Consumption | Standard 500W, Max. 800W | Standard 600W, Max. 850W | Standard 800W, Max. 1.2KW | ||
| Air Pressure | 0.5MPa, 5 L/min | 0.5MPa, 10 L/min | |||
| Transport Concept | Single lane with three stage conveyor (front rail fixed, rear rail adjustable). PCB Length >230mm will automatically switch to single stage. | Dual lane with three stage conveyor (1st rail fixed, L2 & L3 & L4 adjustable). PCB Length >230mm will automatically switch to single stage. | Single lane with three stage conveyor (front rail fixed, rear rail adjustable). PCB Length >850mm will automatically switch to single stage. | ||
| PCB Size (mm) |
L50 × W50 ~ L510 × W510 mm Max. Thickness 6 mm |
L50 × W50 ~ L810 × W690 mm Max. Thickness 6 mm |
Same PCB: L50×W50 ~ L510×W320mm Max. Thickness 6 mm Different PCB: L50×W50 ~ L510×W590mm Max. Thickness 6 mm |
Same PCB: L50×W50 ~ L810×W320mm Max. Thickness 6 mm Different PCB: L50×W50 ~ L810×W590mm Max. Thickness 6 mm |
L50×W50 ~ L2050×W510mm Max. Thickness 10 mm |
| Camera Performance |
Standard: 12MP 12µm (Venus 510 / 810) Standard: 12MP 15µm (Venus 510D / 810D / 2000) Option: 12MP 7µm Option: 21MP 10µm Option: 21MP 7µm |
FOV: 48.9×36.7 mm Speed: 450ms/FOV FOV: 60.8×45.6 mm Speed: 450ms/FOV FOV: 32.7×24.5 mm Speed: 450ms/FOV FOV: 51.2×40.9 mm Speed: 450ms/FOV FOV: 33.3×26.6 mm Speed: 450ms/FOV |
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| PCB Flow | Left to Right, Right to Left, Left to Left, Right to Right (Adjust in Programming) | ||||
| Options | Repair Working Station (Hardware), MES Connection, Offline Programming, Centralized Rejudgment System, SPC Analysis, 8 3D Projector, 7µm Camera Lens, 4 Side View Cameras | ||||
| Other Specification | |||||
| Side Camera | 20M × 4 (Optional) | Numbers of 3D Projector |
Standard: 4 Option: 8 |
Light Source | RGB surrounding light + coaxial light + white light |
| Max. Component Height | Up to 35 mm | Min. Component Size |
Metric 0603 (Standard 12µm / 15µm) Metric 0201 (Option 7µm) |
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| Max. Transport Clearance | Top 50 mm, Bottom 50 mm | Max. PCB Bending Adjustment | ±4 mm | Track Height Above the Ground | 900 ± 50 mm |
| Power Requirements | 200-240V AC 50/60Hz | Operating System | Windows 11 | ||