AOI:

Venus Series

Advanced 3D automated optical inspection system for accurate and reliable SMT quality control
2D + 3D Inspection Technology combining high-resolution imaging, advanced algorithms and AI for comprehensive defect detection.

High-performance 3D Inspection with 7 μm and 12 μm imaging resolution for precise component and solder inspection
Extended component inspection range supporting components up to 35 mm in height
AI-powered programming for fast inspection setup and model changeover in as little as 5 minutes
Precision inspection modes with fast mode and accurate mode to balance inspection speed and measurement detail
PCB warpage compensation with integrated hardware and software solutions for stable and consistent inspection accuracy
Optional 4-D inspection with four side-view cameras for enhanced inspection of component sidewalls, QFN solder joints and other difficult-to-detect defects
High equipment consistency with advanced calibration and standardized inspection functions for reliable performance across production lines
Single lane model: Venus 510 / Venus 810
Dual lane model: Venus 510D / Venus 810D
Large Size model: Venus 1200 / Venus 1500 / Venus 2000

Model Name	Venus 510	Venus 810	Venus 510D	Venus 810D	Venus 2000
Dimension (L×W×H mm)	1100×1450×1600	1400×1600×1600	1100×1600×1600	1400×1600×1600	2800×1460×1600
Weight	1100 kg	1400 kg	1250 kg	1450 kg	2200 kg
Power Consumption	Standard 500W, Max. 800W		Standard 600W, Max. 850W		Standard 800W, Max. 1.2KW
Air Pressure	0.5MPa, 5 L/min		0.5MPa, 10 L/min
Transport Concept	Single lane with three stage conveyor (front rail fixed, rear rail adjustable). PCB Length >230mm will automatically switch to single stage.		Dual lane with three stage conveyor (1st rail fixed, L2 & L3 & L4 adjustable). PCB Length >230mm will automatically switch to single stage.		Single lane with three stage conveyor (front rail fixed, rear rail adjustable). PCB Length >850mm will automatically switch to single stage.
PCB Size (mm)	L50 × W50 ~ L510 × W510 mm Max. Thickness 6 mm	L50 × W50 ~ L810 × W690 mm Max. Thickness 6 mm	Same PCB: L50×W50 ~ L510×W320mm Max. Thickness 6 mm Different PCB: L50×W50 ~ L510×W590mm Max. Thickness 6 mm	Same PCB: L50×W50 ~ L810×W320mm Max. Thickness 6 mm Different PCB: L50×W50 ~ L810×W590mm Max. Thickness 6 mm	L50×W50 ~ L2050×W510mm Max. Thickness 10 mm
Camera Performance	Standard: 12MP 12µm (Venus 510 / 810) Standard: 12MP 15µm (Venus 510D / 810D / 2000) Option: 12MP 7µm Option: 21MP 10µm Option: 21MP 7µm			FOV: 48.9×36.7 mm Speed: 450ms/FOV FOV: 60.8×45.6 mm Speed: 450ms/FOV FOV: 32.7×24.5 mm Speed: 450ms/FOV FOV: 51.2×40.9 mm Speed: 450ms/FOV FOV: 33.3×26.6 mm Speed: 450ms/FOV
PCB Flow	Left to Right, Right to Left, Left to Left, Right to Right (Adjust in Programming)
Options	Repair Working Station (Hardware), MES Connection, Offline Programming, Centralized Rejudgment System, SPC Analysis, 8 3D Projector, 7µm Camera Lens, 4 Side View Cameras
Other Specification
Side Camera	20M × 4 (Optional)	Numbers of 3D Projector	Standard: 4 Option: 8	Light Source	RGB surrounding light + coaxial light + white light
Max. Component Height	Up to 35 mm	Min. Component Size	Metric 0603 (Standard 12µm / 15µm) Metric 0201 (Option 7µm)
Max. Transport Clearance	Top 50 mm, Bottom 50 mm	Max. PCB Bending Adjustment	±4 mm	Track Height Above the Ground	900 ± 50 mm
Power Requirements	200-240V AC 50/60Hz		Operating System	Windows 11