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Ican Series

AI-powered 3D solder paste inspection system for accurate and reliable SMT quality control
Advanced 3D imaging with Dual Moiré projection for precise, shadow-free solder paste measurement
AI-enhanced inspection combining ai technology with proven inspection algorithms to improve detection accuracy

Intelligent one-click programming for fast inspection setup with minimal programming experience
Comprehensive inspection capability for solder paste height, area, volume, displacement and shape
Advanced PCB bending compensation for consistent inspection accuracy under varying production conditions
MES integration & spc data reporting for complete process monitoring, traceability and quality control
High stability & repeatability for consistent inspection performance across production lines
Single lane models: Ican 510 / Ican 810
Dual lane models: Ican 510D / Ican 810D
Large size models: Ican 1200 / Ican 1500 / Ican 2000

Category	Ican 510	Ican 810	Ican 510D	Ican 810D	Ican 1500	Ican 2000
Dimension Size (mm)	1100 × 1450 × 1600	1400 × 1600 × 1600	1100 × 1600 × 1600	1400 × 1600 × 1600	2300 × 1460 × 1600	2800 × 1460 × 1600
Weight	1100kg	1400kg	1250kg	1450kg	2000kg	2200kg
Power Consumption	Standard 500W, Max. 800W		Standard 600W, Max. 850W		Standard 800W, Max. 1.2KW
PCB Size L × W (mm)	50 × 50 ~ 510 × 510 Max. Thickness 6mm	50 × 50 ~ 810 × 690 Max. Thickness 6mm	Same PCB: 50 × 50 ~ 510 × 320 Different PCB: 50 × 50 ~ 510 × 590 Max. Thickness 6mm	Same PCB: 50 × 50 ~ 810 × 320 Different PCB: 50 × 50 ~ 810 × 590 Max. Thickness 6mm	50 × 50 ~ 1550 × 510 Max. Thickness 10mm	50 × 50 ~ 2050 × 510 Max. Thickness 10mm
Transport System	Single track transport system (front track is fixed, rear track L2 can be adjusted)		Dual track transport system (front track is fixed, L2 & L3 & L4 can be adjusted)		Single track (front track is fixed, rear track L2 can be adjusted)	Single track (front track is fixed, rear track L2 can be adjusted), three stages stopping process (PCB Length >850mm will automatically adjust to single stage)
Ican Series Machine General Specifications
Inspection Defects	Sufficient / Insufficient Solder, Miss Printing, Offset, Bad Shape and Bridging, Rusty Board, Angle, Foreign Body
Inspection Items	Height, Area, Volume, Displacement, Shape			PCB Flow	Left to Right, Right to Left, Left to Left, Right to Right (Adjust in programming)
Main Camera’s Resolution	Standard 15um (Option 12um, 10um, 7um, 5um)			Max. Transport Clearance	Top 50mm, Bottom 50mm
Camera Performance	5MP, 36.7 × 30.7 mm (15um), 280ms/FOV			Max. PCB Bending Adjustment	±4mm
Motion Mechanism Precision	XY ±1um, Z ±1um (Option)			Repeat Precision	Volume Area (3σ) < 1% , Height ±1um
Numbers of 3D Projector	Standard 2	Inspection Height	5mm	Minimum Solder Point Spacing	80um	Minimum Measurable Solder Point 80um × 80um
Power Requirements	200-240V AC 50/60Hz			Light Source	Coaxial Light + RGBW	Operating System Windows 11
Options	MES Connection, SPC Analysis, Offline Programming, 7um Camera Lens, 12MP Camera, Feedback to Printer