MS11 for SPI
MS11
MS-11 Series is a inline 3D SPI machine which
inspects the solder amount status after the
solder is spread to clearly grasp the process.
With a 25 Megapixel camera contributing to
productivity enhancements, 0201 (mm) size solder
paste inspection is possible.
- Dimensions (LxWxH): 1080 x 1470 x 1610 mm
- Inspection Capability:
- 6 µm: 0201 (mm) Solder Paste | ±2 mm Warpage
- 10 µm: 0402 (mm) Solder Paste | ±3 mm Warpage
- 15 µm: 0603 (mm) Solder Paste | ±5 mm Warpage
- 20 µm: 0805 (mm) Solder Paste | ±6 mm Warpage
- 3D Inspection Technology: Shadow Free – Moiré 3D Phase Step Image Processing
- Solder Height: Max. 600 µm (Option : 650 µm) Min. 40 µm
- Height Resolution: 0.1 µm
- Height Accuracy: ±1 %
- Inspection Speed:
- 25 Megapixel Camera: 1,800 mm² / Se
- 15 Megapixel Camera: 3,000 – 6,600 mm² / Sec
- 4 Megapixel Camera: 1,500 – 6,000 mm² / Sec
- PCB Top Side Clearance: 20 mm
- PCB Bottom Side Clearance: 50 mm
- PCB Thickness: 0.5 mm ~ 5 mm
- Maximum PCB Weight: 4 kg
- Power Requirements: Single Phase(s) 200~240V 50~60Hz, 1.1 kW
For more detailed information about the equipment and brand download the brochure.