
X6600
X Ray Inspection Machine
For Semiconductor, Packing components for Semiconductor, Packing components | X Ray inspection machine
Seamark ZM X6600 information
Description
Features
Specifications
Detection System
Stage Control Parts
NC Programming
Machine Aplications
Description
X6600 is a cost-effective general-purpose offline precision microfocus X-ray inspection equipment. It is suitable for the inspection of various factory offline products. It has the characteristics of high magnification, multi-angle inspection, and large-area inspection platform.
Aplications:
- LED, SMT, BGA, CSP, Flip Chip Inspection.
- Semiconductor, Packing components.
- Battery Industry.
- Electronic components, Auto parts, Photovoltaic Industry.
- Aluminum Die Casting, Moulding Plastic.
- Ceramics, Other special Industries.
Features
- Meet the needs of general X-ray inspection and have a wide range of applications.
- High-resolution design can obtain the best image in a very short time.
- Infrared automatic navigation and positioning, quickly select the shooting location.
- CNC detection mode, fast automatic detection for multi-point array.
- Oblique multi-angle inspection makes it easier to detect sample defects.
- Software operation is simple and easy to use, low operating cost.
- The X-ray tube and FDP can be rotated at the same time (0-60°), making the detection image more clear and intuitive
Specifications
X-Ray Tube Source Specification | |
Type | Sealed Micro-Focus X-Ray Tube |
Voltage | 90 KV/130KV |
Operating Voltage Range | 40-90KV/130KV |
Operating Current Range | 10-200 μA/300μA |
Max Output Power | 8 W/39W |
Micro Focus Spot Size | 5-15μm |
Flat Panel Detector Specification | |
Type | TFT Industrial Dynamic FPD |
Pixel Matrix | 1536×1536 |
Field of View | 130mm×130mm |
Resolution | 5.8Lp/mm |
Frame(1×1) | 20fps |
A/D Conversion Bit | 16bits |
Dimensions | L1360mm×W1240mm×H1700mm |
Input Power | 220V 10A/110V 15A 50-60HZ |
Max Sample Size | 540 mm×440mm |
Control System | Industrial PC WIN7/ WIN10 64bits |
Net Weight | Approx 1170KG |
Radiation | <1μSv/h |
Max Tilt Angle | 65 degree |
Detection System
Detection of high-definition video: joints open,short,bubbles and other defects at a glance
- 90KV 15 um closed X-ray tube,with long life,maintenance in free
- 3million high resolution digital flat panel detector
- Color image navigation
- Automatic programming detection and automatic analysis Not good or Pass
- More modular panels observation point setting
Stage Control Parts
- By the space bar to adjust stage speed: Slow, Constant and Fast.
- Keyboard control X, Y, Z axis motion and the inclined angle.
- User can detect the samples automatically by programmed.
- Large navigation window, the image is very clear, mouse clicks will move the stage to a position that you need.
NC Programming
- A simple mouse clicks will create a Testing procedures.
- The stage can be X, Y axis positioning; X-ray tube and the detector will be positioning in Z axis.
- Software setting voltage and current.
- Image setting: Brightness, contrast, automatic gain and exposure.
- User can set the program switch pause time.
- The anti-collision system can meet the maximum tilt and observe objects.
- Automatic analysis BGA diameter, Void ratio, size and roundness.
Machine Aplications
- Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
- Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
- Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
- SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
- Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
- Inner rupture or hollow inspection in plastic or metal.
- Battery stacking uniformity, electrode welding inspection.
- Seed, biological material inspection etc.
- Inspection of internal cracks and Defects analysis of internal conditions.