X6600

X6600 is a cost-effective general-purpose offline precision microfocus X-ray inspection equipment. It is suitable for the inspection of various factory offline products. It has the characteristics of high magnification, multi-angle inspection, and large-area inspection platform.

Aplications:

• LED, SMT, BGA, CSP, Flip Chip Inspection.
• Semiconductor, Packing components.
• Battery Industry.
• Electronic components, Auto parts, Photovoltaic Industry.
• Aluminum Die Casting, Moulding Plastic.
• Ceramics, Other special Industries.

• Meet the needs of general X-ray inspection and have a wide range of applications.
• High-resolution design can obtain the best image in a very short time.
• Infrared automatic navigation and positioning, quickly select the shooting location.
• CNC detection mode, fast automatic detection for multi-point array.
• Oblique multi-angle inspection makes it easier to detect sample defects.
• Software operation is simple and easy to use, low operating cost.
• The X-ray tube and FDP can be rotated at the same time (0-60°), making the detection image more clear and intuitive

Detection of high-definition video: joints open,short,bubbles and other defects at a glance

• 90KV 15 um closed X-ray tube,with long life,maintenance in free
• 3million high resolution digital flat panel detector
• Color image navigation
• Automatic programming detection and automatic analysis Not good or Pass
• More modular panels observation point setting

• By the space bar to adjust stage speed: Slow, Constant and Fast.
• Keyboard control X, Y, Z axis motion and the inclined angle.
• User can detect the samples automatically by programmed.
• Large navigation window, the image is very clear, mouse clicks will move the stage to a position that you need.

•  A simple mouse clicks will create a Testing procedures.
• The stage can be X, Y axis positioning; X-ray tube and the detector will be positioning in Z axis.
• Software setting voltage and current.
• Image setting: Brightness, contrast, automatic gain and exposure.
• User can set the program switch pause time.
•  The anti-collision system can meet the maximum tilt and observe objects.
• Automatic analysis BGA diameter, Void ratio, size and roundness.

• Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
• Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
• Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
• SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
• Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
• Inner rupture or hollow inspection in plastic or metal.
• Battery stacking uniformity, electrode welding inspection.
• Seed, biological material inspection etc.
• Inspection of internal cracks and Defects analysis of internal conditions.